SAMCO has developed and released a high-density plasma etching system, the “RIE-331iPC”, to meet the demands of the Asian markets. We will introduce the RIE-331iPC at SEMICON Japan 2011, to be held at Makuhari Messe on December 7th.

We have fully revised our design and developed the RIE-331iPC at a lower cost. By introducing components from oversea suppliers and applying standardized components, we were able to reduce the price significantly. Additionally, the RIE-331iPC has a 20% smaller foot print and 26% less weight, which will save clean room space and shipping costs.

SAMCO will meet customer demand in Asia and improve customer satisfaction by releasing products at reasonable price and using components from local suppliers.