RIE-200LC (Cassette-to-Cassette)

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Vacuum Cassette Type Reactive Ion Etching System
SAMCO's RIE-200LC is a high specification RIE system equipped with a load lock and vacuum cassette chamber. These vacuum chambers allow safe and repeatable etching using chlorine gases, while improving the systems throughput.
The RIE-200LC yields excellent etching patterns with minimum side etch for a wide variety of materials such as metals, compound semiconductors (GaAs, GaN, etc.), silicon and poly-silicon. The user friendly touch panel interface enables the operator to easily create, edit, store and manage etch recipes.

Dimensions:

Main Unit: 1206(W) x 2000(D) x 2003(H) mm

Process single wafers up to 8" inches or batches of multiple wafers
The process chamber is isolated from the environment by a load-lock chamber, which improves process reliability and accuracy
The wafers are stored in a vacuum cassette chamber which prevents after etch corrosion when using chlorine gases and improves throughput
Electrostatic chuck for wafer clamping and active substrate temperature control
High speed and uniform multi-port evacuation system

Superior anisotropic etching performance for silicon films (Si, Poly-Si, SiO₂, Si₃N₄ etc)
Etching of various metal films
Etching of compound semiconductors such as GaAs, GaN, etc.
Production of waveguide devices
Fabrication of micromachines