Reactive Ion Etching System
SAMCO's RIE-300NR is a high-performance, fully automatic, high precision Reactive Ion Etching system, designed for processing 300mm wafers. A computerized touch panel provides a user-friendly interface for parameter control and recipe storage.
Etching is performed with minimum sidewall deterioration and a high selectivity between materials. The RIE-300NR chamber is equipped with four-directional pumping mechanism that maximizes uniformity.

Applications

• Anisotropic etching of all types of silicon-based films, compound semiconductors and refractory metals including Si, SiO2, Poly-Si, SiN, GaAs and Mo
• Manufacturing of micromachines
• Stripping passivation, SiN and Oxide layers perfectly for semiconductor failure analysis

Features

• Process wafers up to 12" in diameter (Twelve 75mm wafers, eight 100mm wafers or three 150mm wafers)
• Fully automatic "One-button" operation with full manual override
• Highly selective anisotropic etching
• Easy to use computerized touch panel for parameter control, recipe entry and storage

Dimensions:

Main Unit: 850(W) x 1680(D) x 1913(H) mm

Pump Unit: 590(W) x 170(D) x 230(H) mm