Reactive Ion Etching System
SAMCO's RIE-6000 is a large batch type reactive ion etching system used to etch all types of semiconducting, insulating and metallic films.

Applications

• Superior anisotropic etching performance for silicon films used in ULSI devices
• Etching of refractory metal films
• Fabrication of light waveguides
• Fabrication of micromachines
• Manufacturing of various types of sensors
• Processing of wafer level chip scale packages

Features

• Large sample stage (600x600mm)
• Easy to use computerized touch panel enables fully automatic operation of the system, as well as management of process parameters
• Max. 5KW RF generator (water cooled)
• Up to 4 mass flow controllers (MFC)
• Equipped with compound turbo and backing dry pumps
• Recipe storage and data logging

Dimensions:

Main Unit: 1100(W) x 1720(D) x 2000(H) mm
Controller: 570(W) x 630(D) x 1843(H) mm
Pump unit: 400(W) x 760(D) x 906(H) mm
Chiller: 570(W) x 677(D) x 1236(H) mm