Etching systems

ICP Etching Systems

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ICP Etching system takes advantage of the latest inductively coupled plasma (ICP) technology. SAMCO's proprietary ICP plasma source, the "Tornado Coil Electrode", enables reliable and uniform etching required for next generation devices.

RIE-101iPH

RIE-101iPH

  • R&D type ICP etching system
  • Manual loading, up to 4" wafers
  • Manual robot transfer, load-lock
  • Fluorine & Chlorine compatible

Details

RIE-140iP

RIE-140iP

  • Process up to 4" wafers
  • Plasma at low powers and pressure
  • Active temperature control
  • Laser Diode applications

Details

RIE-200iP

RIE-200iP

  • Up to 6" wafers (8" optional)
  • Manual loading, load-lock
  • ESC and He backside cooling
  • Small footprint and "all-in-one" design

Details

RIE-100iPC

RIE-100iPC

  • Low cost, high value, small footprint design concept
  • High-speed Direct transfer of max. 8" wafers
  • Fabrication of SAW devices
  • Active temperature control

Details

RIE-140iPC (Cassette-to-Cassette)

RIE-140iPC (Cassette-to-Cassette)

  • Process up to 4" wafers
  • Precise vacuum control and stability
  • Active temperature control
  • Lower Damage highly chemical etching

Details

RIE-200iPC (Cassette-to-Cassette)

RIE-200iPC (Cassette-to-Cassette)

  • Production type system
  • Processes up to 8" wafers
  • Cassette holds 25x 6" wafers
  • ESC and Helium backside cooling

Details

RIE-330iPC (Cassette-to-Cassette)

RIE-330iPC (Cassette-to-Cassette)

  • Production type ICP System
  • 330mm sample stage
  • Process up to three 6" wafers
  • Cassette holds 5 wafer trays
  • ESC and Helium backside cooling

Details

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