ICP Etching system takes advantage of the latest inductively coupled plasma (ICP)
technology. SAMCO's proprietary ICP plasma source, the "Tornado Coil Electrode", enables reliable
and uniform etching required for next generation devices.
- R&D type ICP etching system
- Process up to 4" wafers
- load-locked type
- Fluorine & Chlorine compatible
- Process up to 4" wafers
- Plasma at low powers and pressure
- Active temperature control
- Laser Diode applications
- Up to 6" wafers (8" optional)
- load-locked type
- ESC and He backside cooling
- Small footprint and "all-in-one" design
- Low cost, high value, small footprint design concept
- High-speed Direct transfer of max. 8" wafers
- Fabrication of SAW devices
- Active temperature control
- Process up to 4" wafers
- Precise vacuum control and stability
- Active temperature control
- Lower Damage highly chemical etching
- Production type system
- Processes up to 8" wafers
- Cassette holds 25x 6" wafers
- ESC and Helium backside cooling
- Production type ICP System
- 330mm sample stage
- Process up to three 6" wafers
- Cassette holds 5 wafer trays
- ESC and Helium backside cooling
- Stable processing at high RF powers and low pressures
- High capacity vacuum system
- Height-adjustable lower electrode
- High voltage ESC
> Etching Systems
> ICP (Inductively Coupled Plasma) Etching Systems
