Deep Reactive Ion Etching (DRIE) systems are designed for the BOSCH process
(licensed from Robert Bosch GmbH) to achieve superior high-speed, deep, vertical etching of
silicon for MEMS and 3D-LSI processes.
- High rate Bosch etching system
- Up to 4" wafers
- Deep Silicon etching (Bosch)
- ESC and Helium backside cooling
- High rate Bosch etching system
- Up to 8" wafers
- ESC and Helium backside cooling
- For MEMS, TSV and 3D Packaging,
- Process up to 8" wafers
- ESC with Active wafer temperature control
- Anti-tilt' feature for vertical etching across the entire wafer
- For MEMS and TSV (3D packaging)
> Etching systems
> Deep Silicon Etching Systems
