LS-CVD systems | SAMCO Inc.

> CVD systems > LS-CVD systems

SAMCO's LS (Liquid Source) CVD systems achieve superior step-coverage and gap-fill performance, required for the MEMS, 3D-LSI, and Opto Electronics markets. Importantly, the technology enables deposition at lower temperatures and doesn't require toxic or flammable gases. LS-CVD systems can deposit high-quality TEOS-SiO2, LS-SiN, High-k think film, and Diamond-like-carbon (DLC).

PD-100ST

Low temperature deposition
High deposition rates (>300nm/min)
Highly conformal films for MEMS and other High Aspect Applications
TSV and 3D packaging development

PD-270STP

Liquid source CVD system
Low-temperature thick oxide deposition
Process up to 8" wafers
High deposition rates

PD-270STL

Liquid source CVD system
Low-temperature thick oxide deposition
Process up to 8" wafers
Load lock version of the PD-270STP

PD-270STLC

Liquid source CVD system
Low-temperature thick oxide deposition
Process up to 8" wafers
Cassette-to-cassette production system

PD-330STLC

Process up to 12" wafers
High deposition rates
Deposit in high aspect holes with complete conformity
For TSV, 3D packaging and MEMS