UV-Ozone Cleaning System
SAMCO's UV-300 uses a combination of ultraviolet radiation and ozone to remove organic materials from a variety of substrates, improve wettability and enhance adhesion. The UV-300 is clean, reliable and simple to operate. Unlike plasma cleaning systems, it does not damage delicate structures or require a complicated, high-maintenance vacuum system. Nor does it use wet chemistry's messy, corrosive or toxic solvents.

Applications

• Removing organic contamination
• Pre-clean wafers prior to deposition/coating
• Ink removal from wafers
• Descumming of photoresist and polyimide
• Surface modification for better adhesion
• Improving lube coverage on magnetic disks
• UV curing
• Growth of thin stable oxide films on silicon and gallium arsenide (e.g. MOS gate oxide)

Features

• Large reaction chamber accommodates substrates of varying sizes up to 12" in diameter
• Rotating sample stage ensures high uniformity of cleaning /stripping rate across the substrate surface
• Built-in "ozone killer" for complete removal of ozone in the exhaust
• Simple to operate
• Temperature control (Ambient to 300°C)
• Completely dry process and will not cause any electrical damage to circuits
• Operates at atmospheric pressure
• Door interlock system

Dimensions:

Main Unit: 550(W) x 430(D) x 605(H) mm