UV-Ozone Cleaning System
SAMCO's UV-300H utilizes a combination of ultraviolet light, a high concentration of ozone and controlled heating to provide effective cleaning and stripping without causing electrical damage to circuits. Substrates are loaded into the system through a sliding drawer.
Applications include removing ink dots following test, photoresisit and polyimide ashing and cleaning of organic contamination.
This high-performance unit provides photoresist ashing rates of up to 5000 A/min. and includes numerous safety features to protect the operator and the system. The UV-300H operates at atmospheric pressure, and does not require a cumbersome, high maintenance vacuum system.

Applications

• Stripping of photoresist and polyimide
• Removing ink from EPROM wafers without erasing programs
• Removing organic contamination from substrates prior to thin film deposition
• Surface preparation for lube or photoresist
• Descumming photoresist and E-beam resist
• Cleaning prior to wafer bonding

Features

• Utilizes a unique combination of ultraviolet light, high-concentration ozone and controlled heating for efficient cleaning
• Soft" completely dry process will not cause electrical damage to circuits
• Easy, drawer type loading of substrates
• Compact, uses minimum clean room space
• Temperature control (Ambient to 300°C)
• Operates at atmospheric pressure - no vacuum system required
• Safety features include: drawer interlock, automatic purge cycle, air pressure interlock, cooling water interlock, ozone scrubber and emergency off switch

Dimensions:

Main Unit: 698(W) x 800(D) x 1306(H) mm