Inductively Coupled Plasma (ICP) Etching System Model RIE-800iPB (High Rate BOSCH)

SAMCO's RIE-800iPB is an inductively coupled plasma (ICP) etching system that uses high-density plasma to perform the deep silicon etching required by MEMS devices. The system is equipped with a 3kW RF generator and a 2000 liters/sec. TMP.

The RIE-800iPB is specifically designed for the BOSCH process (licensed from Robert Bosch GmbH) to achieve superior performance for high-speed deep vertical etching of silicon.

The electrode configuration efficiently generates a stable high-density plasma, and precisely etches deep silicon structures with a high degree of uniformity and selectivity.

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Applications

• Manufacturing of MEMS devices
• Etching of via holes for 3D packaging
• Manufacturing of sensors

Click here to view SEM images on Etching of Square Holes in Silicon using the Bosch process(313 KB)