samco-ucp remote source plasma cleaners meet various types of process needs in device production.
Typical applications include
· Cleaning of metal leadframes, plastic microelectronic packages, MEMS or micro-optic packages, hybrid or multi-chip modules as well as wafers
· Surface treatment used e.g. before die attach, wire bonding or molding for improvement of gluing, adhesion or encapsulation
· Optimum surface activation and soft chemical removal e.g. of oxides and organics by process gases and mixtures of Ar, N2 and H2
The LFC150 is a manual load batch system designed for surface cleaning of various types of lead-frame packages typically housed in magazines. This system possesses a large process chamber (I.D. 630 mm, height 170 mm) for batch plasma processing, and it operates with a remote DC plasma source generated by a hot filament.
Same Magazine In and Out Remote Source Plasma Cleaner
The LFC063 can handle various types of chip carrier substrates up to 280 mm x 330 mm with high throughput. This system is capable of plasma treatment with high throughput using simultaneous (un)loading from/to magazine and plasma processing in auto-mode. Remote plasma processing ensures that sensitive substrates are effectively shielded from the primary RF plasma.
The SuperLiner Wafer offers remote source plasma cleaning of substrates up to Ø12” with cassette loading. This system provides left-in, right-out operation. State-of-the-art dual-arm robot handles both standard and thin-wafer substrates.
The FlexLiner ll can handle substrates up to 330 mm x 330 mm. The FlexLiner ll enables left-in, right-out operation suitable for production line. One of the unique features of this system is gentle substrate handling with minimal movement of substrates. Furthermore, multiple sensor control enables sophisticated substrate sensing for most reliable operation.
Samco plasma cleaners can process samples for surface modification.
Cyclic Olefin Copolymer (COC) coupons were processed using a plasma cleaner and characterized with water contact angle.
Depending on the process recipe, the samples showed hydrophobic or hydrophobic surfaces.
Contact Angle : 90.9°
COC after Hydrophilic Treatment
Contact Angle : 5.8°
COC after Hydrophobic Treatment
Contact Angle : 128.0°
|Open Load Remote Source Plasma Cleaner||Same Magazine In and Out Remote Source Plasma Cleaner||Left-in, Right-out
Remote Source Plasma Cleaners
|System Name||LFC150||LFC063||SuperLiner Wafer||FlexLiner ll|
|Loading||Manual Loading||Magazine Loading||Cassette Loading||Magazine Loading|
|Maximum Sample Size||Ø8”||280 mm x 330 mm||Ø12”||330 mm x 330 mm|
|Plasma Source||Hot Cathode||Hollow Cathode|
|System Control||Easy-to-use Touch-panel GUI|
• Cleaning of metal leadframes, plastic microelectronic packages,
• Surface treatment used e.g. before die attach, wire bonding or molding
• Optimum surface activation and soft chemical removal
DC Downstream Plasma
The batch-type plasma cleaners of the LFC150 family operate with a low pressure DC plasma generated by a hot filament. The patented plasma chemical cleaning process takes advantage of low-energy ions and radicals that react with surface contaminants to form volatile compounds.
RF Downstream Plasma
samco-ucp single-substrate plasma cleaners use damage-free plasma chemical treatment. The excitation of the process gas is accomplished by an RF powered hollow cathode source. Remote plasma processing ensures that sensitive substrates are effectively shielded from the primary RF plasma.
Gentle Substrate Handling
Sophisticated substrate sensing enables gentle substrate handling with minimal movement of substrates for most reliable operation with high throughput.