Remote Source Plasma Cleaners

SAMCO Inc. > Cleaning Systems > Remote Source Plasma Cleaners

samco-ucp remote source plasma cleaners meet various types of process needs in device production.
Typical applications include
· Cleaning of metal leadframes, plastic microelectronic packages, MEMS or micro-optic packages, hybrid or multi-chip modules as well as wafers
· Surface treatment used e.g. before die attach, wire bonding or molding for improvement of gluing, adhesion or encapsulation
· Optimum surface activation and soft chemical removal e.g. of oxides and organics by process gases and mixtures of Ar, N2 and H2

Open Load
Remote Source
Plasma Cleaner

remote source plasma cleaner

The LFC150 is a manual load batch system designed for surface cleaning of various types of lead-frame packages typically housed in magazines. This system possesses a large process chamber (I.D. 630 mm, height 170 mm) for batch plasma processing, and it operates with a remote DC plasma source generated by a hot filament.

Same Magazine In and Out Remote Source Plasma Cleaner

ucp remote plasma cleaner

The LFC063 can handle various types of chip carrier substrates up to 280 mm x 330 mm with high throughput. This system is capable of plasma treatment with high throughput using simultaneous (un)loading from/to magazine and plasma processing in auto-mode. Remote plasma processing ensures that sensitive substrates are effectively shielded from the primary RF plasma.

Left-in, Right-out
Remote Source
Plasma Cleaners

Cassette Loading Remote Source Plasma Cleaner

The SuperLiner Wafer offers remote source plasma cleaning of substrates up to Ø12” with cassette loading. This system provides left-in, right-out operation. State-of-the-art dual-arm robot handles both standard and thin-wafer substrates.

The FlexLiner ll can handle substrates up to 330 mm x 330 mm. The FlexLiner ll enables left-in, right-out operation suitable for production line. One of the unique features of this system is gentle substrate handling with minimal movement of substrates. Furthermore, multiple sensor control enables sophisticated substrate sensing for most reliable operation.

Process Examples

Wettability Modulation

Samco plasma cleaners can process samples for surface modification.
Cyclic Olefin Copolymer (COC) coupons were processed using a plasma cleaner and characterized with water contact angle.
Depending on the process recipe, the samples showed hydrophobic or hydrophobic surfaces.

Initial (COC)

Initial COC
Contact Angle : 90.9°

Hydrophilic Treatment (COC)

COC after Hydrophilic Treatment
Contact Angle : 5.8°

Hydrophobic Treatment (COC)

COC after Hydrophobic Treatment
Contact Angle : 128.0°

Specification Chart

Open Load Remote Source Plasma Cleaner Same Magazine In and Out Remote Source Plasma Cleaner Left-in, Right-out
Remote Source Plasma Cleaners
System Name LFC150 LFC063 SuperLiner Wafer FlexLiner ll
Loading Manual Loading Magazine Loading Cassette Loading Magazine Loading
Maximum Sample Size Ø8” 280 mm x 330 mm Ø12” 330 mm x 330 mm
Plasma Source Hot Cathode Hollow Cathode
Power 60 A
DC
600 W
RF
Gases 2
Max. 3
2
Max. 4
System Control Easy-to-use Touch-panel GUI
CE Compatible
Applications

• Cleaning of metal leadframes, plastic microelectronic packages,
MEMS or micro-optic packages, hybrid or multi-chip modules as well as wafers

• Surface treatment used e.g. before die attach, wire bonding or molding
for improvement of gluing, bonding or encapsulation

• Optimum surface activation and soft chemical removal
e.g. of oxides and organics by process gases and mixtures of Ar, N2, and H2

System Features

 DC Downstream Plasma

DC plasma

The batch-type plasma cleaners of the LFC150 family operate with a low pressure DC plasma generated by a hot filament. The patented plasma chemical cleaning process takes advantage of low-energy ions and radicals that react with surface contaminants to form volatile compounds.

 RF Downstream Plasma

RF downstream plasma

samco-ucp single-substrate plasma cleaners use damage-free plasma chemical treatment. The excitation of the process gas is accomplished by an RF powered hollow cathode source. Remote plasma processing ensures that sensitive substrates are effectively shielded from the primary RF plasma.

Gentle Substrate Handling

Magazine Loading Plasma Cleaning

Sophisticated substrate sensing enables gentle substrate handling with minimal movement of substrates for most reliable operation with high throughput.

  • Plasma Cleaners

Testimonial

 Samco plasma cleaners are used for device fabrication and material processing at nanofabrication facilities including

Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Contact us for more detail.

Our remote source plasma cleaners are a good choice for gentle plasma treatment of various samples such as lead-frame and polymer components.

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