Scientific paper on high-selectivity SiO2 etching by Fudan University

August 23, 2018 Samco 2018 Customer, SAMCO Customer Publication, Silicon/Dielectrics Etch, SiO2 Etch

Highly selective etch of silicon dioxide with tungsten hard mask deposited by PVD process

Yuanhui Fang, Jian Zhang, Yu-Long Jiang
School of Microelectronics, Fudan University, Shanghai 200433, China
2018 18th International Workshop on Junction Technology (IWJT), Shanghai, 2018, pp. 1-3.

Samco RIE Plasma Etching Equipment was used for tungsten etching and SiO2 etching with the tungsten hardmask.

Openload RIE System