1. PSS Fabrication by Sapphire Etching
Samco offers Patterned Sapphire Substrate (PSS) fabrication processes using ICP plasma etching technologies. The height and width of cone shape is adjustable with customers’ requests.
4. Electrode Formation
6. Passivation Deposition by PECVD
Batch processing of 6 x Ø4-inch wafers show high uniformity of SiO2 deposition.
Batch-to-batch Deposition Uniformity : ±0.2 %
Deposition Rate : 12.2 nm/min
7. Contact Hole Formation
Double Cassettes and multi-joint robot wafer handling of Samco’s atmospheric cassette RIE etchers improve throughput of SiO2 etching for contact hole formation. The systems show stable SiO2 etch uniformity around ± 1.5% over 25 x ø4”wafers.
8. Dicing and Wire Bonding
Samco offers plasma scribing processes for compound semiconductor materials. Single wafer processing and batch processing of small wafers are available using state-of-the-art wafer handling methods.