Process Solutions for Laser Diode Manufacturing

SAMCO Inc. > Markets > Process Solutions for Laser Diode Manufacturing

 1. GaN/AlGaN/InGaN Epi Growth

GaN/AlGaN/InGaN Epi Growth
MOCVD Systems
Wafers in MOCVD System Chamber

Samco MOCVD systems offer batch processing of small wafers.

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2. Ridge Formation with End Point Monitoring

Ridge Formation with End Point Monitoring
End Point Detection

Samco ICP etch systems are equipped with optional optical or interferometric endpoint monitor. The endpoint monitor enables precise etch depth control, combined with specially developed low-speed etch process.

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3. Photoresist Removal

Photoresist Ashing
Plasma Cleaner for SAW Device Manufacturing
UV-Ozone System for Photoresist Ashing

Samco holds multiple system lineup (plasma cleaners and UV-Ozone cleaners) for photoresist stripping to meet customers’ demands.

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4. Passivation Film Deposition by PECVD

Passivation Film Deposition by PECVD
Stress Control of SiH4-SiO2

 SiH4 Flow Rate v.s. Film Stress

Uniformity and Deposition Rate of SiH4-SiO2

SiH4 Flow Rate v.s. Uniformity/Deposition Rate

SiO2 film properties are highly controllable with experienced process recipes.

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5. Exposure of p-Contact Layer (SiO2 Etching)

Exposure of p-Contact Layer (SiO2 Etching)
Atmospheric Cassette RIE Systems
SiO2 Etching for Contact Hole Formation

Samco’s atmospheric cassette RIE etchers equipped with double cassettes and multi-joint robot for wafer transfer improve throughput of SiO2 etching for contact hole formation.  The systems show stable SiO2 etch uniformity around ± 1.5% over 25 x ø4”wafers.

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7. p-Electrode Formation by Sputtering

p-Electrode Formation by Sputtering

Creating p-electrode by sputtering Palladium (Pd) and Platinum (Pt).

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8. Wafer Polishing

Substrate Polishing

Polish away GaN substrate from the wafer backside to be 100 µm thick.

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9. n-Electrode Formation by Sputtering

n-Electrode Formation

Sputter Titanium (Ti), Platinum (Pt), and Gold (Au) subsequently to create n-electrode.

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10. Wafer Dicing 

Wafer Dicing for Laser Diode Fabrication
Plasma Dicing

Samco provides plasma scribing processes for compound semiconductor materials. Fragile and small samples can be handled using a wafer carrier and a reliable transfer robot.

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11. Reflective Layer Formation (SiO2 or SiNx deposition by PECVD)

Reflective Layer Formation (SiO2 or SiNx deposition by PECVD)
Advanced Innerwall

One of unique system features of Samco anode PECVD systems is Advanced Innerwall. Protective shield inside the reaction chamber will control disposal of the plasma discharge and improve deposition uniformity.

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12. Surface Cleaning before Packaging

Laser Diode
Bench-top Plasma Cleaner
tabletop plasma cleaner

Samco’s plasma cleaners can process multiple wafers in one time with optional shelves.

Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Contact us for more detail.
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