MEMS Device Manufacturing Process

SAMCO Inc. > Markets > MEMS Device Manufacturing Process

 1. Deep Silicon Etching by the Bosch Process

Silicon DRIE by the Bosch Process
SOI Etch
tilt free Bosch Etch

Insulating layers of SOI substrates are widely used for a silicon etch stop in MEMS device fabrication. SAMCO has developed a unique notch-free SOI etching process that maintains the etch selectivity by using superimposed Radio Frequency (RF) power. Furthermore, The deep silicon etch processes are performed without tilt across ø6″ or 8”wafers.

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2. Photoresist Ashing

Photoresist Ashing for MEMS Device Fabrication
Bench-top Plasma Cleaner
N2 purge cassette chamber

SAMCO plasma cleaners are suitable for photoresist ashing in MEMS device fabrication. For high-volume production, RIE systems with atmospheric double cassettes will enhance throughput.

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3. SiO2 Sacrificial Layer Removal

Sacrificial SiO2 Layer Removal
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4. Surface Cleaning before Packaging

MEMS Accelerometer
Plasma Cleaner for SAW Device Manufacturing
UV-Ozone System for Photoresist Ashing

SAMCO plasma cleaners provides process solutions of surface cleaning before packaging. For the materials sensitive to physical damage by ion bombardment and charging, UV-Ozone cleaners would be an option.

Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Any questions? Contact us for more detail.
Contact SAMCO for more product information
Contact us for more detail.
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