CSW 2026 (Compound Semiconductor Week)

If you are interested in discussing our process capabilities, please visit our booth.

1. Atomic Layer Etching (ALE) Systems — Highly controlled etching for precise, atomic-scale material removal critical for advanced III-V and wide-bandgap device processing.
2. ICP Etching Systems — Versatile plasma etch tools offering high anisotropy and selectivity for compound semiconductor patterning and device fabrication.
3. PECVD Systems — Plasma enhanced chemical vapor deposition platforms for conformal dielectric and passivation layers on compound semiconductor structures.
4. R&D Process Tools — Equipment tailored for research environments focusing on novel material integration, prototyping, and process development.
5. Surface Treatment Solutions — Advanced cleaning and surface conditioning tools for optimized interface and device performance.