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No sidewall or bottom roughness
A smooth and precisely defined pillar structure with a diameter of 0.7 µm and a depth of 4 µm has been successfully formed. The process achieves vertical sidewalls with no measurable roughness and a defect-free bottom surface, ensuring excellent structural integrity.
This high-precision etching process is ideal for applications such as semiconductor lasers and photonic crystals, where smooth surfaces and precise geometry are essential to achieve optimal optical and electronic performance.