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  • Products
    • Deposition Systems
      • Atomic Layer Deposition (ALD)
      • Anode PECVD
      • Cathode PECVD
    • Etching Systems
      • Atomic Layer Etching (ALE)
      • Inductively Coupled Plasma (ICP) Etching
      • Si Deep Reactive Ion Etching (DRIE)
      • Reactive Ion Etching (RIE) – Plasma Etching
      • Xenon Difluoride (XeF2) Etching
    • Surface Treatment Systems
      • Aqua Plasma®
      • Plasma Cleaning
      • UV Ozone Cleaning
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      • Atomic Layer Deposition (ALD)
      • Anode PECVD
      • Cathode PECVD
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      • Compound Semiconductor Etching
        • GaN Etching
        • GaAs Etching
        • InP Etching
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      • Aqua Plasma®
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      • UV Ozone Cleaning
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Daily Archives: September 6, 2024

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Part 1 – Introduction to Si DRIE (Silicon Deep Reactive Ion Etching)

TutorialsBy MeganSeptember 6, 2024

Bosch Process Tutorial: Part 1. Intro to Si DRIE Silicon is most well-known as a semiconductor material, but because of its high mechanical strength and ease of processing, it is also commonly used in a wide variety of devices such as MEMS, optical components, micro-channel devices, and packaging. There are many methods for processing silicon,…

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