Dual chamber system
The RIE-802BCT is a silicon deep reactive ion etching system designed for high-volume production. Equipped with two reaction chambers, the system provides high-throughput Si deep etching for a wide range of device applications.
An atmospheric cassette loader, wafer edge protection ring, and high-precision wafer aligner are included as standard features, supporting stable wafer handling and reliable production performance.
The system enables high-aspect-ratio etching of over 100:1 and low-scallop processing while maintaining a high etch rate and high selectivity to resist masks.
Key Features & Benefits
High-Aspect-Ratio Processing
The unique plasma generator and reactor structure enable high-aspect-ratio etching while maintaining vertical sidewall profiles.Low-Scallop Processing
High-speed gas switching reduces scallop size while maintaining a high etch rateExtensive Bosch Process Expertise
In 2003, Samco became the first Japanese equipment manufacturer to obtain a license for the Bosch process. Since then, Samco has built an extensive process library that supports a wide range of etched profiles, materials, and application requirements.
Applications
- Fabrication of MEMS (acceleration sensors, gyro sensors, pressure sensors, actuators, etc.)
- Inkjet printhead fabrication
- Formation of Through-silicon via (TSV)
- Power device manufacturing, including superjunction MOSFETs
- Plasma dicing
