Scientific Paper on Silicon Photonic Circuit Fabrication from University of Delaware

October 19, 2014 Samco 2014 Customer, Photonic Devices, Samco Customer Publication, Si Etch, Silicon/Dielectrics Etch, Silicon/Dielectrics PECVD, SiO2 PECVD

Packaging and design of a heterogeneous dual laser chip for a widely tunable spectrally pure optical RF source

David W. Grund Jr., Garrett J. Schneider, Janusz Murakowski, and Dennis W. Prather
Electrical and Computer Engineering, University of Delaware, Newark, Delaware, USA
Optics Express (2014) 22, 17, pp. 19838-19849

Samco ICP Etch System was used for silicon fine etching.
Then, Samco PECVD System was used for SiO2 layer deposition to isolate a metal heater from the etched silicon layer.

For details of SiO2 PECVD process capabilities, please visit the page below.
SiO2 PECVD Process