Institute of Science Tokyo: Professor Yasuyuki Miyamoto
Advancing high-speed transistors with InP and GaN, Professor Yasuyuki Miyamoto explores the future of compound semiconductors and shares insights on Samco’s key role in research.
Part 4 – Loading Effect and Microloading Effect in Silicon Deep Reactive Ion Etching
Explore loading and microloading effects in silicon DRIE and how process optimization improves etch uniformity and depth control in MEMS fabrication.
Part 3 – Equipment Advances for the Bosch Process
Learn key Bosch process hardware advances (including ICP source design, RF power control, fast gas switching, and pumping) to improve Si DRIE performance and profiles.
Part 2 – What is the Bosch Process (Deep Reactive Ion Etching)?
Learn how the Bosch process enables deep silicon DRIE with high aspect ratio features, using cyclic deposition and etching steps for anisotropic profiles and high selectivity.
Part 1 – Introduction to Si DRIE (Silicon Deep Reactive Ion Etching)
An introduction to Si DRIE, comparing Bosch, non-Bosch, and cryogenic processes and how Samco systems support MEMS, TSV, and packaging applications.