Surface Treatment of Gold Using Aqua Plasma®
Aqua Plasma® treatment prevents oxidation, reduces gold surface oxides, and improves hydrophilicity for semiconductor manufacturing processes.
Part 3 – Equipment Advances for the Bosch Process
Learn key Bosch process hardware advances (including ICP source design, RF power control, fast gas switching, and pumping) to improve Si DRIE performance and profiles.
AlGaN/GaN Etch Challenges for GaN Power Device Fabrication
Explore key etching challenges in AlGaN/GaN power device fabrication and solutions for precise plasma etching of GaN-based semiconductor structures.