⌀8″
Load Lock
Bosch Process
none
Trusted equipment with extensive process library
Samco’s RIE-800iPB is a high-performance inductively coupled plasma (ICP) etching system that uses high-density plasma for deep silicon etching required by MEMS and TSV applications.
The RIE-800iPB is a dedicated silicon etching system optimized for the Bosch process, licensed from Robert Bosch GmbH. Its proprietary reaction chamber, electrode, stage and vacuum designs overcomes the problems encountered in competing systems to allow high-rate (~50 μm/min), tilt-free profiles, high aspect-ratio etching, and industry leading selectivity of over 100:1.
Key Features & Benefits
- High rate etching in MEMS mass production
- High aspect ratio etching in mass production
- Control of scalloping / Scallop-less non-bosch process
- Excellent uniformity with tilt control
- Bias pulsing for notch control at silicon on insulator (SOI) wafers
- Extended process library
Applications
- MEMS (acceleration sensors, gyroscopes, pressure sensors, actuators, etc.)
- Through Silicon Via (TSV)
- Processing of the inkjet printer head
- Power devices (super-junction MOSFETs)
- Plasma Dicing/Scribing
