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  • Products
    • Deposition Systems
      • Atomic Layer Deposition (ALD)
      • Anode PECVD
      • Cathode PECVD
    • Etching Systems
      • Atomic Layer Etching (ALE)
      • Inductively Coupled Plasma (ICP) Etching
      • Si Deep Reactive Ion Etching (DRIE)
      • Reactive Ion Etching (RIE) – Plasma Etching
      • Xenon Difluoride (XeF2) Etching
    • Surface Treatment Systems
      • Aqua Plasma®
      • Plasma Cleaning
      • UV Ozone Cleaning
  • Processes
    • Deposition
      • Atomic Layer Deposition (ALD)
      • Anode PECVD
      • Cathode PECVD
    • Etching
      • Atomic Layer Etching (ALE)
      • Compound Semiconductor Etching
        • GaN Etching
        • GaAs Etching
        • InP Etching
      • Silicon Etching & DRIE
      • Metal/Dielectric Etching
      • Failure Analysis
    • Surface Treatment
      • Aqua Plasma®
      • Plasma Cleaning
      • UV Ozone Cleaning
  • Markets
  • News & Events
    • Events
    • News
    • Technical Reports
    • Interviews
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Tag Archives: ALD

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Dual-Chamber ALD System AD-8002LPC

Introduction to the Dual-Chamber ALD System AD-8002LPC

Technical reportsBy MeganMay 22, 2026

Samco’s AD-8002LPC dual-chamber ALD system enables stable TiOx deposition, reduced takt time, and flexible thermal and plasma ALD processing.

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