Simultaneous Double-sided Wafer Deposition via Plasma Enhanced ALD
Report investigating simultaneous dual-surface deposition of AlOx films on silicon wafers using the Plasma Enhanced Atomic Layer Deposition (PEALD) technique.
Samco featured in TIME Magazine: Taking a Quantum Leap
We are pleased to share that Samco Inc. has been featured in TIME magazine. In the article “Taking a Quantum Leap,” the story traces our journey from a Kyoto garage in the 1970s—where we developed our first PECVD system—to our current role as a global supplier of semiconductor processing equipment. CEO Osamu Tsuji reflects on…
Introduction to the 700°C High-Temperature PECVD System PD-101TC
Introduction Plasma-enhanced chemical vapor deposition (PECVD) systems were initially developed for low-temperature film deposition. However, recent diversification in research and development needs has led to a demand for systems capable of high-temperature film deposition. PECVD systems, a cornerstone of Samco, utilize silicon tetrahydride (SiH4) gas for silicon nitride (SiN) and silicon dioxide (SiO2) film deposition.…
Northwestern University – NUFAB: Nasir Basit, PhD.
Micro- and nanoscale device research, deposition and etching processes using RIE and PECVD for advanced structures.