Surface Treatment of Gold Using Aqua Plasma®

Discover the innovative Aqua Plasma® technology that transforms gold surface treatment in semiconductor manufacturing. This approach prevents oxidation and enhances the hydrophilicity of gold surfaces, making it versatile for various applications. Our study shows how Aqua Plasma® reduces gold oxides and improves bonding, ensuring optimal performance in critical processes. Explore the benefits of Aqua Plasma® and its potential to enhance your manufacturing practices. Contact our team for more information or to arrange a demonstration with our production-scale equipment!

Part 3 – Equipment Advances for the Bosch Process

Bosch Process Tutorial: Part 3. Equipment Advances for the Bosch Process In this article, we introduce the hardware employed to fully utilize the capabilities of the Bosch process for deep etching of silicon. The equipment used for the Bosch process has many significant features that differentiate it from typical ICP etching tools. Inductively Coupled Plasma…

AlGaN/GaN Etch Challenges for GaN Power Device Fabrication

As one of the most promising materials in compound semiconductors, Gallium Nitride (GaN) demonstrates high electron mobility and a wide bandgap, enabling numerous next-generation applications. GaN-based devices, from High Brightness LEDs in consumer electronics to emerging power devices, are central to advancements in displays, lighting, and high-performance power systems. The unique AlGaN/GaN heterointerface generates a…

Innovation with the New Plasma Source HSTC-M™

Introduction of ICP Etching System for SiC/GaN Power Devices up to 8 Inches Samco Inc. Introduction Since the introduction of ICP etching systems in 1996, Samco has consistently delivered innovative process technology and reliable systems to the compound semiconductor market. Our proprietary Tornado ICP® coil, much like Hideo Nomo1, the first Japanese Major League Baseball…