Samco Inc. donates to the Red Cross Society
Samco Inc. donates 10 million JPY to the Japanese Red Cross Society, continuing its annual support for disaster relief and humanitarian efforts.
AJOU University Students Visit Samco for Industry Insights
Ajou University students visit Samco for a hands-on look at semiconductor manufacturing and a Q&A session with CEO Osamu Tsuji during their Japan study tour.
Ohio State University Students Visit Samco Inc. Headquarters
Samco welcomed Ohio State University students to Kyoto HQ. The students explored Samco’s history and learned about the semiconductor manufacturing field.
Institute of Science Tokyo: Professor Yasuyuki Miyamoto
Advancing high-speed transistors with InP and GaN, Professor Yasuyuki Miyamoto explores the future of compound semiconductors and shares insights on Samco’s key role in research.
Special Lecture on GaN Technology by Nagoya University Professor Jun Suda
Professor Jun Suda of Nagoya University gave a special lecture at Samco on GaN devices, sharing insights on materials, processing, and future technologies.
Samco featured in TIME Magazine: Taking a Quantum Leap
TIME magazine features Samco’s journey from a Kyoto garage startup to a global semiconductor equipment leader in the article “Taking a Quantum Leap.”
Indian Students from Kyoto University’s KU-STAR Program Visit Samco
Samco welcomed KU-STAR Program students from top Indian universities for a factory tour, tech talk, and cultural exchange during their academic stay in Kyoto.
Kyushu University – CSeDE: Professor Reiji Hattori
Research at Kyushu University explores next-gen display electronics, from AR/VR and micro-LEDs to retinal scanning and semiconductor devices.
Samco Strengthens Collaboration with IIT Delhi, Advancing Japan-India Technology and Talent Exchange
Samco strengthens collaboration with IIT Delhi to advance Japan–India technology exchange, energy research, and talent development.
Introduction of the Single-Wafer Aqua Plasma® System
Samco’s single-wafer Aqua Plasma® system for wafer cleaning and descum processes, delivering improved ashing rates, uniformity, and throughput.