Stable Device Isolation Processing for 6-Inch GaN-Based Power Devices
GaN device isolation etching using ICP-RIE and endpoint detection enables uniform processing and stable multi-wafer semiconductor production.
GaN device isolation etching using ICP-RIE and endpoint detection enables uniform processing and stable multi-wafer semiconductor production.
Advancing high-speed transistors with InP and GaN, Professor Yasuyuki Miyamoto explores the future of compound semiconductors and shares insights on Samco’s key role in research.
Professor Jun Suda of Nagoya University gave a special lecture at Samco on GaN devices, sharing insights on materials, processing, and future technologies.
MIT Professor Tomás Palacios visited Samco to discuss next-generation microelectronics, advanced materials, and potential research collaboration.
Explore key etching challenges in AlGaN/GaN power device fabrication and solutions for precise plasma etching of GaN-based semiconductor structures.