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  • Products
    • Deposition Systems
      • Atomic Layer Deposition (ALD)
      • Anode PECVD
      • Cathode PECVD
    • Etching Systems
      • Atomic Layer Etching (ALE)
      • Inductively Coupled Plasma (ICP) Etching
      • Si Deep Reactive Ion Etching (DRIE)
      • Reactive Ion Etching (RIE) – Plasma Etching
      • Xenon Difluoride (XeF2) Etching
    • Surface Treatment Systems
      • Aqua Plasma®
      • Plasma Cleaning
      • UV Ozone Cleaning
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      • Atomic Layer Deposition (ALD)
      • Anode PECVD
      • Cathode PECVD
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      • Compound Semiconductor Etching
        • GaN Etching
        • GaAs Etching
        • InP Etching
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      • Plasma Cleaning
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Tag Archives: GaN

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  2. Entries tagged with "GaN"

Technical Report

Stable Device Isolation Processing for 6-Inch GaN-Based Power Devices

Technical reportsBy MeganMarch 11, 2026

GaN device isolation etching using ICP-RIE and endpoint detection enables uniform processing and stable multi-wafer semiconductor production.

Institute of Science Tokyo: Professor Yasuyuki Miyamoto

InterviewsBy MeganJuly 7, 2025

Advancing high-speed transistors with InP and GaN, Professor Yasuyuki Miyamoto explores the future of compound semiconductors and shares insights on Samco’s key role in research.

Special Lecture on GaN Technology by Nagoya University Professor Jun Suda

NewsBy MeganJune 17, 2025

Professor Jun Suda of Nagoya University gave a special lecture at Samco on GaN devices, sharing insights on materials, processing, and future technologies.

MIT’s Dr. Tomás Palacios Visits Samco to Explore Future Microelectronics Innovations

NewsBy MeganMarch 24, 2025

MIT Professor Tomás Palacios visited Samco to discuss next-generation microelectronics, advanced materials, and potential research collaboration.

AlGaN/GaN Etch Challenges for GaN Power Device Fabrication

Technical reportsBy MeganNovember 8, 2024

Explore key etching challenges in AlGaN/GaN power device fabrication and solutions for precise plasma etching of GaN-based semiconductor structures.

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