Simultaneous Double-sided Wafer Deposition via Plasma Enhanced ALD
Report investigating simultaneous dual-surface deposition of AlOx films on silicon wafers using the Plasma Enhanced Atomic Layer Deposition (PEALD) technique.
Introduction of the Single-Wafer Aqua Plasma® System
Introduction Since its founding, our company has been developing and designing equipment with superior environmental, health, and safety (EHS) features. In 2016, we launched the Aqua Plasma® cleaner, which utilizes water as its primary material, characterized by being safe and environmentally friendly. The product has been well received by many customers. The Aqua Plasma® process…
UV-Ozone Cleaning: Fundamentals, Advantages, and Applications
UV Ozone Cleaning UV Ozone cleaning is a widely used method for preparing and cleaning surfaces in material research and device fabrication. As an alternative to oxygen plasma cleaning, it relies on a unique photochemical reaction to clean and modify surfaces with precision and efficiency. This page explains the fundamentals, advantages, and applications of UV…
Surface Treatment of Gold Using Aqua Plasma®
Discover the innovative Aqua Plasma® technology that transforms gold surface treatment in semiconductor manufacturing. This approach prevents oxidation and enhances the hydrophilicity of gold surfaces, making it versatile for various applications. Our study shows how Aqua Plasma® reduces gold oxides and improves bonding, ensuring optimal performance in critical processes. Explore the benefits of Aqua Plasma® and its potential to enhance your manufacturing practices. Contact our team for more information or to arrange a demonstration with our production-scale equipment!