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Search:
  • Products
    • Deposition Systems
      • Atomic Layer Deposition (ALD) Systems
      • Anode PECVD Systems
      • Cathode PECVD Systems
    • Etching Systems
      • Atomic Layer Etching (ALE) Systems
      • Inductively Coupled Plasma (ICP) Etching Systems
      • Si Deep Reactive Ion Etching (DRIE) Systems
      • Reactive Ion Etching (RIE) – Plasma Etching Systems
      • Xenon Difluoride (XeF2) Etching Systems
    • Surface Treatment Systems
      • Aqua Plasma® Cleaners
      • Plasma Cleaning Systems
      • UV Ozone Cleaning Systems
  • Processes
    • Deposition
      • Atomic Layer Deposition (ALD)
      • Anode PECVD
      • Cathode PECVD
    • Etching
      • Atomic Layer Etching (ALE)
      • Compound Semiconductor Etching
      • Silicon Etching & DRIE
      • Metal/Dielectric Etching
      • Failure Analysis
    • Surface Treatment
      • Aqua Plasma®
      • Plasma Cleaning
      • UV Ozone Cleaning
  • Markets
  • News & Events
    • Events
    • News
    • Disclosure
    • Technical Reports
    • Interviews
    • Tutorials
  • About
    • Company Overview
    • Global Locations
    • History
  • Contact
    • Product Info Request
    • Technical Support Request
    • Careers

Technical Reports

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Samco’s Technical Reports offer in-depth information on our latest research and developments. These reports feature a wide range of topics, from detailed findings and system information to comprehensive explanations of our processes. Aimed at industry professionals, students, and anyone interested in semiconductor technology, our reports provide valuable insights into our ongoing innovations and technical advancements.

Introduction of the Single-Wafer Aqua Plasma® System

Technical reportsApril 9, 2025
700°C High-Temperature PECVD System PD-101TC

Introduction to the 700°C High-Temperature PECVD System PD-101TC

Technical reportsFebruary 10, 2025
Figure 1. SEM image of a SiC trench processed by RIE-800iPC

ICP Etching Process for Realizing SiC Trench MOSFETs

Technical reportsJanuary 29, 2025

Surface Treatment of Gold Using Aqua Plasma®

Technical reportsNovember 13, 2024

AlGaN/GaN Etch Challenges for GaN Power Device Fabrication

Technical reportsNovember 8, 2024

Long-Term Process Stability of “PD-220 Series” Systems

Technical reportsSeptember 14, 2024

Innovation with the New Plasma Source HSTC-M™

Technical reportsJuly 28, 2024

Introduction of the Three-Chamber CVD System “PD-2203LC”

Technical reportsFebruary 14, 2024

Aqua Plasma Boost® and AQ-2000BT: Excellent for Reducing Large Sized Samples of Oxidized Copper

Technical reportsApril 28, 2023
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