Simultaneous Double-sided Wafer Deposition via Plasma Enhanced ALD
Report investigating simultaneous dual-surface deposition of AlOx films on silicon wafers using the Plasma Enhanced Atomic Layer Deposition (PEALD) technique.
Report investigating simultaneous dual-surface deposition of AlOx films on silicon wafers using the Plasma Enhanced Atomic Layer Deposition (PEALD) technique.
Samco welcomed Ohio State University students to Kyoto HQ. The students explored Samco’s history and learned about the semiconductor manufacturing field.
Advancing high-speed transistors with InP and GaN, Professor Yasuyuki Miyamoto explores the future of compound semiconductors and shares insights on Samco’s key role in research.