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  • Products
    • Deposition Systems
      • Atomic Layer Deposition (ALD)
      • Anode PECVD
      • Cathode PECVD
    • Etching Systems
      • Atomic Layer Etching (ALE)
      • Inductively Coupled Plasma (ICP) Etching
      • Si Deep Reactive Ion Etching (DRIE)
      • Reactive Ion Etching (RIE) – Plasma Etching
      • Xenon Difluoride (XeF2) Etching
    • Surface Treatment Systems
      • Aqua Plasma®
      • Plasma Cleaning
      • UV Ozone Cleaning
  • Processes
    • Deposition
      • Atomic Layer Deposition (ALD)
      • Anode PECVD
      • Cathode PECVD
    • Etching
      • Atomic Layer Etching (ALE)
      • Compound Semiconductor Etching
        • GaN Etching
        • GaAs Etching
        • InP Etching
      • Silicon Etching & DRIE
      • Metal/Dielectric Etching
      • Failure Analysis
    • Surface Treatment
      • Aqua Plasma®
      • Plasma Cleaning
      • UV Ozone Cleaning
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Yearly Archives: 2025

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  2. 2025

Cornell University EMBA Students Visit Samco Inc. to Explore Innovation and Semiconductor Leadership in Japan

NewsBy MeganApril 7, 2025

Cornell EMBA students visited Samco’s Kyoto headquarters to explore semiconductor innovation, leadership, and cross-cultural business insights.

MIT’s Dr. Tomás Palacios Visits Samco to Explore Future Microelectronics Innovations

NewsBy MeganMarch 24, 2025

MIT Professor Tomás Palacios visited Samco to discuss next-generation microelectronics, advanced materials, and potential research collaboration.

700°C High-Temperature PECVD System PD-101TC

Introduction to the 700°C High-Temperature PECVD System PD-101TC

Technical reportsBy MeganFebruary 10, 2025

Samco introduces the PD-101TC PECVD system, enabling high-temperature thin film deposition up to 700°C for advanced semiconductor research.

What is Atomic Layer Deposition (ALD)?

TutorialsBy MeganFebruary 6, 2025

Learn the fundamentals of Atomic Layer Deposition (ALD), a thin-film technique enabling atomic-scale thickness control, conformal coatings, and high-quality films.

Nasir Basit PhD. in front of NUFAB

Northwestern University – NUFAB: Nasir Basit, PhD.

InterviewsBy MeganJanuary 29, 2025

Micro- and nanoscale device research, deposition and etching processes using RIE and PECVD for advanced structures.

Figure 1. SEM image of a SiC trench processed by RIE-800iPC

ICP Etching Process for Realizing SiC Trench MOSFETs

Technical reportsBy MeganJanuary 29, 2025

Advanced ICP trench etching for SiC MOSFETs achieving over 700 nm/min etch rates, rounded trench bottoms, and high uniformity on 6-inch wafers.

National Institute of Advanced Industrial Science and Technology (AIST): Takahiro Mori Ph.D.

InterviewsBy MeganJanuary 23, 2025Leave a comment

Research on silicon spin qubits for quantum computing, using PD-2201LC, RIE-400iPC, and RIE-230LC.

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