Samco Inc. (TSE: 6387), was honored to host Dr. Tomás Palacios, Director of the Microsystems Technology Laboratories at MIT and Clarence J. LeBel Professor in Electrical Engineering and Computer Science, during his visit to discuss potential collaborations in research and development. His visit marks an exciting opportunity to explore advancements in microelectronics through innovative materials,…
Introduction Plasma-enhanced chemical vapor deposition (PECVD) systems were initially developed for low-temperature film deposition. However, recent diversification in research and development needs has led to a demand for systems capable of high-temperature film deposition. PECVD systems, a cornerstone of Samco, utilize silicon tetrahydride (SiH4) gas for silicon nitride (SiN) and silicon dioxide (SiO2) film deposition.…
Atomic Layer Deposition Tutorial: Introduction to ALD Atomic Layer Deposition (ALD) is a thin-film deposition technique that utilizes self-limiting surface chemical reactions to achieve precise layer-by-layer growth. By alternately introducing and exhausting two or more reactants into the reaction chamber, ALD enables excellent film thickness control, superior step coverage, and high conformality. As demand for…
Micro- and nanoscale device research, deposition and etching processes using RIE and PECVD for advanced structures.
Advanced ICP trench etching for SiC MOSFETs achieving over 700 nm/min etch rates, rounded trench bottoms, and high uniformity on 6-inch wafers.
Research on silicon spin qubits for quantum computing, using PD-2201LC, RIE-400iPC, and RIE-230LC.