Aqua Plasma Boost® and AQ-2000BT: Excellent for Reducing Large Sized Samples of Oxidized Copper
Samco developed Aqua Plasma Boost® to enhance oxidized copper reduction using reducing gas and water vapor.
Samco developed Aqua Plasma Boost® to enhance oxidized copper reduction using reducing gas and water vapor.
Aqua Plasma® used for surface
modification of CO2 separation
nanomembranes.
Topological, diamond, and quantum nanophotonics, redefining light control and driving next-generation photonic innovation.
Samco’s Aqua Plasma® improves microbump fabrication by enhancing photoresist and Cu hydrophilization, preventing oxidation, and enabling better plating solution penetration for fine patterns.
Introduction Compared to the mainstream semiconductor Si, the wide bandgap semiconductor 4H-SiC has excellent material qualities including higher electrical breakdown strength and higher thermal conductivity. Therefore, 4H-SiC has been studied in recent years as a new material to improve miniaturization and energy saving in power devices. Currently, it is being developed not only for device…