National Institute of Advanced Industrial Science and Technology (AIST): Takahiro Mori Ph.D.
Research on silicon spin qubits for quantum computing, using PD-2201LC, RIE-400iPC, and RIE-230LC.
Research on silicon spin qubits for quantum computing, using PD-2201LC, RIE-400iPC, and RIE-230LC.
Learn how UV-ozone cleaning works, its advantages over plasma cleaning, and applications in semiconductor surface preparation and materials research.
Explore loading and microloading effects in silicon DRIE and how process optimization improves etch uniformity and depth control in MEMS fabrication.
Aqua Plasma® treatment prevents oxidation, reduces gold surface oxides, and improves hydrophilicity for semiconductor manufacturing processes.
Learn key Bosch process hardware advances (including ICP source design, RF power control, fast gas switching, and pumping) to improve Si DRIE performance and profiles.
Explore key etching challenges in AlGaN/GaN power device fabrication and solutions for precise plasma etching of GaN-based semiconductor structures.
Learn how the Bosch process enables deep silicon DRIE with high aspect ratio features, using cyclic deposition and etching steps for anisotropic profiles and high selectivity.
Long-term data shows stable SiN deposition using Samco’s PD-220 plasma CVD systems, maintaining ±2% uniformity over six months with reduced maintenance downtime.
Nanophotonics research, advanced applications, and the role of RIE-10NR in ICFO’s photonics projects.
An introduction to Si DRIE, comparing Bosch, non-Bosch, and cryogenic processes and how Samco systems support MEMS, TSV, and packaging applications.