Indian Students from Kyoto University’s KU-STAR Program Visit Samco
Samco welcomed KU-STAR Program students from top Indian universities for a factory tour, tech talk, and cultural exchange during their academic stay in Kyoto.
Kyushu University – CSeDE: Professor Reiji Hattori
Research at Kyushu University explores next-gen display electronics, from AR/VR and micro-LEDs to retinal scanning and semiconductor devices.
Samco Strengthens Collaboration with IIT Delhi, Advancing Japan-India Technology and Talent Exchange
Samco strengthens collaboration with IIT Delhi to advance Japan–India technology exchange, energy research, and talent development.
Introduction of the Single-Wafer Aqua Plasma® System
Samco’s single-wafer Aqua Plasma® system for wafer cleaning and descum processes, delivering improved ashing rates, uniformity, and throughput.
Cornell University EMBA Students Visit Samco Inc. to Explore Innovation and Semiconductor Leadership in Japan
Cornell EMBA students visited Samco’s Kyoto headquarters to explore semiconductor innovation, leadership, and cross-cultural business insights.
MIT’s Dr. Tomás Palacios Visits Samco to Explore Future Microelectronics Innovations
MIT Professor Tomás Palacios visited Samco to discuss next-generation microelectronics, advanced materials, and potential research collaboration.
Introduction to the 700°C High-Temperature PECVD System PD-101TC
Samco introduces the PD-101TC PECVD system, enabling high-temperature thin film deposition up to 700°C for advanced semiconductor research.
What is Atomic Layer Deposition (ALD)?
Learn the fundamentals of Atomic Layer Deposition (ALD), a thin-film technique enabling atomic-scale thickness control, conformal coatings, and high-quality films.
Northwestern University – NUFAB: Nasir Basit, PhD.
Micro- and nanoscale device research, deposition and etching processes using RIE and PECVD for advanced structures.
ICP Etching Process for Realizing SiC Trench MOSFETs
Advanced ICP trench etching for SiC MOSFETs achieving over 700 nm/min etch rates, rounded trench bottoms, and high uniformity on 6-inch wafers.