Part 2 – What is the Bosch Process (Deep Reactive Ion Etching)?
Learn how the Bosch process enables deep silicon DRIE with high aspect ratio features, using cyclic deposition and etching steps for anisotropic profiles and high selectivity.
Long-Term Process Stability of “PD-220 Series” Systems
Long-term data shows stable SiN deposition using Samco’s PD-220 plasma CVD systems, maintaining ±2% uniformity over six months with reduced maintenance downtime.
ICFO: Dr. Johann Osmond
Nanophotonics research, advanced applications, and the role of RIE-10NR in ICFO’s photonics projects.
Part 1 – Introduction to Si DRIE (Silicon Deep Reactive Ion Etching)
An introduction to Si DRIE, comparing Bosch, non-Bosch, and cryogenic processes and how Samco systems support MEMS, TSV, and packaging applications.
Innovation with the New Plasma Source HSTC-M™
Samco introduces the HSTC-M™ plasma source for uniform, stable ICP etching of SiC and GaN power devices up to 8-inch wafers across research and production systems.
RIKEN: Dr. Takuo Tanaka
Optical metamaterials research, including nanostructures for light manipulation and high-sensitivity molecular detection, using Samco’s RIE-400iP.
Samco Announces Sale of Advanced Etching Systems to III-V Lab in Europe
Samco announces the sale of two RIE-400iP ICP-RIE systems to France-based III-V Lab to support advanced III-V semiconductor and silicon integration research.
FORTUNE Magazine: Kyoto’s Semiconductor Success
Samco is featured in FORTUNE Businessweek on Kyoto’s semiconductor strength, highlighting Samco’s global growth, R&D expansion, and innovation rooted in Kyoto.
Toyohashi University of Technology: Dr. Hiroto Sekiguchi
Bio-implantable microLED devices using RIE-200NL and PD-220NL systems.
Introduction of the Three-Chamber CVD System PD-2203LC
Overview of three-chamber CVD system PD-2203LC, enabling stable SiN/SiO2 deposition with flexible frequency options for research and production.