As the human life span and the proportion of older people are increasing, to maintain the quality of life it is very important to recognize the sign of diseases at early stage .
One promising means of achieving this is the “Point-of-care Testing (POCT)”, which obtains, analyses and diagnoses biomarkers of different diseases from the body fluids. This means examinations can be carried out quickly at the patient’s circumstances such as at home or neighbor clinic. It is considered that the POCT can improve the quality of the medical care in terms of moderating therapeutic policies and the dosage of medications by allowing timely treatment according to the results. However, existing biomarker analyses are time consuming and costly because they are carried out by specialized medical centers. Moreover, blood test requires a few ml of blood. Microfluidic chips are expected to be a new technology that enables POCT to be carried out cheaply and easily, with only a small amount of body fluids but in the meantime maintain a high sensitivity and accuracy.
To continue, please submit the form on the right.
Compared to the mainstream semiconductor Si, the wide bandgap semiconductor 4H-SiC has excellent material qualities including higher electrical breakdown strength and higher thermal conductivity.Therefore, 4H-SiC has been studied in recent years as a new material to improve miniaturization and energy saving in power devices. Currently, it is being developed not only for device fabrication but also for practical
applications in the automotive and power supply industries. SiC MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) are one example of commonly used 4H-SiC power devices that surpass Si power devices in terms of high voltage endurance, low on-resistance, and high-speed switching. Trench type SiC MOSFETs are being developed and have shown that they are capable of achieving a reduced on-resistance, which is highly demanded in current devices. We have been developing a trench etching process using plasma dry etching and deposition of the gate insulator using ALD (Atomic Layer Deposition) and PECVD (Plasma Enhanced Chemical Vapor Deposition). These processes are required for manufacturing trench type SiC MOSFETs.
In this paper, we will highlight the SiC trench etching and gate insulator deposition results.
To continue, please submit the form on the right.
Deputy Prime Minister of Liechtenstein Thomas Zwiefelhofer invited Samco Chairman and CEO Osamu Tsuji, samco-ucp President Christian Linder and samco-ucp Director Nakanobu Seki to the country’s government building in Vaduz at the beginning of November in order to express his gratitude to Samco for making Liechtenstein its sales and service base in Europe through its subsidiary samco-ucp.
Samco, a semiconductor process equipment developer and manufacturer based in Japan, announced that it will open its Malaysia branch office on Aug. 10, 2016 in Petaling Jaya, a suburb of Kuala Lumpur.
“With our new office conveniently located near Kuala Lumpur, we expect to better serve Malaysia’s research universities and manufacturers,” says Osamu Tsuji, Samco’s chairman, president and CEO. “Four company representatives will be assigned to this new location, where they will actively provide production-type systems and services, consisting of the three major technologies Samco specializes in.”
Samco, a Japan-based semiconductor processing equipment manufacturer, held a completion ceremony for its second production center on June 17. The new production center, which began construction in January and is expected to begin operations during the fall of this year, boosts Samco’s original shipment capacity of 6-7 billion yen per year to a total of 10-11 billion yen per year.
Samco increases local sales staff for North American, European and Asian locations, aims to expand overseas sales
Samco is employing around 20 more people at its locations in North America, China, Taiwan and Singapore, as well as its subsidiary Samco-UCP in Liechtenstein, in order to better provide services and support to overseas customers.
“Increasing the number of Samco employees abroad is part of the company’s larger strategy to optimize our current sales structure while actively growing our customer base across the globe,” says Osamu Tsuji, Samco’s President, Chairman and CEO.
SAMCO held its first thin film technology workshop in India at the Indian Institute of Technology Bombay on February 2nd. The event, entitled “MEMS and Nano Processes”, was a collaboration with Professor V. Ramgopal Rao of IIT Bombay’s Electrical Engineering Department.
“With a growing economy that is expected to accelerate in the future, India continues to set an example for emerging markets around the world through its innovative research and development activities,” said Osamu Tsuji, SAMCO’s President, Chairman and CEO, during his opening remarks at the workshop.